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Cover image for book Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

By:G.Q. Zhang; ‎L.J. Ernst; ‎O. de Saint Leger
Publisher:Springer Nature
Print ISBN:9781441948731
eText ISBN:9781475731590
Edition:1
Format:Page Fidelity

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