Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
| By: | Jörg Franke |
| Publisher: | Hanser Publications |
| Print ISBN: | 9781569905517 |
| eText ISBN: | 9781569905524 |
| Edition: | 1 |
| Format: | Page Fidelity |
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